Thermal Gap Filler

Laird TechnologiesThermal Interface Materials
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Thermal Conductivity (W/m-K):
Product Name:
Tflex 300
Thickness (mm):
0.5 - 5(by increments of 0.25)
Width (mm):
10 - 229(by increments of 0.25)
Length (mm):
10 - 229(by increments of 0.25)
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Specifications
Supplier part number: TIM_Gap_Filler
Downloads:266
Name:Thermal Gap Filler
Description:

Laird gap filler pads are used to bridge the interface between hot components and a chassis or heat sink assembly to increase the overall heat transfer from the system. The unique combination of thermal conductivity and softness reduces mechanical stress while maintaining thermal performance. 

Laird’s extensive gap filler product lines includes:

  • Products ranging from 1-34 W/mk Thermal conductivity
  • Thickness ranges from 0.25mm to 5mm
  • High Deflection Series (Tflex HD300, Tflex HD700, Tflex HD8000, and Tflex HD90000)

Industries:

  • Consumer Electronics
  • Automotive
  • Telecom
  • Data Infrastructure
  • Industrial 
  • Aerospace & Defense

Website Link: Product Catalog Page