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Part Number
Supplier
Micropap Engineering SL
Description
3x3mm package 0.5mm pitch
Tags
Contributed by
Company
MICROPAP ENGINEERING SL
Configurations?
No
Downloads
1
Added on
13 Dec, 2019
Part Number
Supplier
Analog Devices
Description
Isolated, Synchronous Forward Controller with Active Clamp and iCoupler
Contributed by
Company
ALSTOM
Configurations?
No
Downloads
0
Added on
11 Dec, 2019
Description
None Provided
Contributed by
Company
IYTE
Configurations?
No
Downloads
0
Added on
11 Dec, 2019
Name
Part Number
Supplier
Pmod RS232
Description
Pmod RS232
Contributed by
Company
Turkey
Configurations?
No
Downloads
1
Added on
11 Dec, 2019
Name
Description
TSOPII-54; 0.8mm pitch; 22.22x11.76mm; 1.25mm height; height offset = 0
Contributed by
Company
RG-Group
Configurations?
No
Downloads
3
Added on
10 Dec, 2019
Name
Supplier
Hynix
Description
FBGA78, 7.5*11 mm case; 0.8 mm pitch; 0.45 mm balls;0.34 mm model height offset.Hynix DDR3 RAM.
Contributed by
Company
RG-Group
Configurations?
No
Downloads
3
Added on
8 Dec, 2019
Description
QFN-24 Punch Package with 4x4mm Body and 0.5mm Pitch
Contributed by
Company
RG-Group
Configurations?
No
Downloads
7
Added on
7 Dec, 2019
Supplier
various
Description
IC, 24 pin SOIC package
Tags
Contributed by
Company
Nordson Asymtek
Configurations?
No
Downloads
6
Added on
4 Dec, 2019
Name
Description
VQFN package, 3 x 3mm, 1mm max height, 16 pins
Contributed by
Company
MRQ
Configurations?
No
Downloads
17
Added on
27 Nov, 2019
Part Number
Supplier
Infineon
Description
Infineon PG-DSO-36-58 dual gate driver package
Contributed by
Company
TG Drives
Configurations?
No
Downloads
6
Added on
26 Nov, 2019